[Austin (Texas, États-Unis) 15 avril 2022 PR Newswire = Kyodo News JBN]
* Hardware-aware software promotes maximum hardware performance, accelerates time-to-market, and drives improved green printing.
The Open Computer Project (OCP) Foundation, a non-profit organization that brings hyperscale innovation to everyone, announced on the 15th that it has a new hardware-software co-design strategy (https://c212.net /c/link/?T=). 0 & L = EN & O = 3505917-1 & h = 209 548 490 & U = https% 3A% 2F% 2f146A55Aca6f00848C565-A7635525D40AF1C70300198708935525D40AF1C70300198708935525D40Af1C70300198708935525d408935525D40Acf1.RackCDN.com% 2FIMages% 2FE1616CBCF1F761B6E6F351C. This includes Microsoft and Intel’s recent contributions to OCP via the Flexible I/O (Input/Output) Virtualization (SIOV) specification, as well as examples from the Linux Foundation’s current collaboration with the SONiC project.
George Tchaparian, CEO of the Open Compute Project Foundation, said, “Hardware-software co-design is about optimizing hardware performance, and system performance and environmental footprint is software. Focuses on software that requires in-depth knowledge of hardware to reduce time to market for hardware that relies heavily on hardware interaction New OCP hardware-software co-design We are glad that Microsoft and Intel have brought new contributions as part of our strategy and that we can continue to collaborate on the SONiC project at the Linux Foundation.”
Hardware-software co-design takes on new importance as software workloads become more diverse and require specialized silicon to achieve the best performance with acceptable energy and environmental costs. System software or firmware is designed to use knowledge of the underlying hardware architecture to make appropriate technical trade-offs along the cost-performance curve to achieve environmentally friendly software.
Scalable I/O Virtualization by Microsoft and Intel (https://c212.net/c/link/?t=0&l=en&o=3505917-1&h=3080198232&u=https%3A%2F%2Fwww.opencompute.org%2Fdocuments%2Focp -scalable-io-virtualization-technical-specification-revision-1-v1-2-pdf&a=Scalable+I%2FO+Virtualization) The specification’s recent contribution is hardware for large-scale I/O virtualization. S. Hardware and Software Architecture This is an important example of OCP’s hardware-software collaboration strategy provided by SIOV. This spec is an evolution of SR-IOV (Single Root I/O Virtualization) that removes scaling restrictions and brings hundreds and thousands of VMs (virtual machines) and software containers to the latest natives of the cloud today. pools that meet software requirements. OCP aims to foster a healthy SIOV-centric community and be a catalyst to drive innovation in silicon and cloud architecture.
The collaboration between OCP and the Linux Foundation has expanded with the addition of the SONiC project. Hardware-Switch Abstraction Interface (SAI) (https://www.opencompute.org/documents/switch-abstraction-interface-ocp-specification-v0-2-pdf) project that remains in OCP to match software co-design Currently, collaboration continues around SONiC led by the Linux Foundation. This collaboration will enable the Linux Foundation software development community to benefit from greater acceptance of SONiC, create support for OCP-certified switching hardware, and open new markets for OCP-certified equipment. While SONiC is the preferred operating system for many large-scale data center operators, other market segments require special features, and SAI enables these markets to choose the switch operating system that suits the better for their use case.
“The data center infrastructure market is changing, driven by increasing silicon diversity driven by the adoption of AI and ML workloads,” said Ashish Nadkarni, group vice president, Infrastructure and Systems. global infrastructure, IDC. This diversity is reshaping the market under pressure. to provide a high-performance IT infrastructure that also manages power and environmental footprint. The combination of these requirements is hardware-software. Collaborative design is essential. “
▽ Support for the main stakeholders
Ronak Singhal, Principal Researcher and Chief Architect for Intel Xeon Technology and Roadmap at Intel, said, “Intel is committed to open standards to empower a comprehensive and innovative ecosystem. By partnering with the Open Compute Project to deploy new Scalable I/O Virtualization (SIOV) specifications. The entire ecosystem of processors and PCIe devices can accelerate the adoption of more scalable, efficient, and high-performance I/O virtualization for the hyperscale era. »
Dave Maltz, SONiC Foundation Executive and Microsoft Technical Fellow/Corporate Vice President, said, “SONiC’s open-source network operating system enables rapid innovation in the network ecosystem. It started with the abstraction interface (SAI) at OCP. OCP and SONiC have grown together over the past few years. A great contributor. Now SONiC is joining the Linux Foundation to expand the community and industry in which it provides services. OCP and the LF SONiC Foundation are part of OCP’s hardware-software co-design strategy. We will continue to work closely with all hardware specifications and SAI.”
Arpit Joshipura, Managing Director of Networking Edge and IoT at the Linux Foundation, said, “The Linux Foundation welcomes SONiC, a leader in open source data center NOS deployment, to participate in our growing open network project and our development community. We are focused on the software components of SONiC. We look forward to partnering with the Open Compute Foundation (OCP) to adjust the hardware and specifications like SAI.”
▽ About the Open Compute Project Foundation
At the heart of the Open Compute Project (OCP) is a community of hyperscale data center operators, telecommunications providers, colocation providers, and enterprise IT users who work with vendors to deploy cloud to the periphery when integrating products. The OCP Foundation is responsible for encouraging and supporting the OCP community to respond to the market and shape the future, bringing innovation at scale to all. Commercialization is achieved through open design and best practices, as well as data center facilities and IT equipment that incorporate innovations developed by the OCP community for efficiency, large-scale operations and sustainability. Shaping the future involves investing in strategic efforts to prepare for major shifts in the computing ecosystem, including AI and ML, optics, advanced cooling technologies, and composable silicon. For more information, please visit www.opencompute.org.
▽ Media contact details
Open Computing Project Foundation
Vice President, Marketing Director
Mobile: +1 303-999-7398
(Central Time Zone/CST/Houston, TX)
Source: Open Computing Project Foundation